Ibhalwe ngu: Michael Macpherson Vacuum Reflow Soldering
Ngaba ukhe wazibuza okomzuzwana ukuba ikhompyuter okanye ifowuni yakho isebenza njani? Iqala ngeemicrochips ezincinci kunye neesekethe ezithengiswa kunye. I-Soldering yenza into efana neglue ekhethekileyo eqinisekisa ukuba ezi ndawo zihlala kwindawo yazo echanekileyo. I-Soldering, kwelinye icala bubuchule obusoloko busetyenziswa kwixesha elidlulileyo ekwakheni ezi ntlobo zoqhagamshelo oluthi ngelixa lusebenza lunokuba nobumdaka lwayo ukwenza kunye ne-toput enobungozi yonke into kunye. Faka itekhnoloji yevacuum reflow - inkqubo ejolise ekucingeni ngokutsha iindlela zakwantu ngokufumana iziphumo ezifanayo, kodwa usebenzisa inguqulelo entsha kunye nokhuseleko olongezelelweyo.
Itekhnoloji ye-vacuum reflow inenzuzo enye ebalulekileyo ngaphezulu kwe-solder ye-atmospheric kuba inokuvelisa awona malungu alungileyo e-solder. Kunokuba unyibilikise i-solder ngedangatye elivulekileyo okanye ipleyiti eshushu njengeendlela zendabuko, i-vacuum reflow isebenzisa indawo elawulwayo ukuhambisa i-solder ecocekileyo kwaye ethembekileyo. Le ngcamango inokuthi ithintele amacandelo ekubeni ashushu kakhulu kwaye enze umonakalo, ngaphandle kokuba kuyabiza ukuyilungisa kuthatha ixesha elide.
Oku kukwamela enye inzuzo yokuphinda ivacuum-inokusetyenziselwa kancinci uncamathiselo lwe-solder. Ngokusebenzisa i-vacuum, i-solder engaphezulu iyasuswa nto leyo ekhokelela kwinkunkuma encinci kunye nobumdaka xa kuthelekiswa nendlela izinto ezenziwa ngayo ngokwesiko! Oku kunceda ukonga iindleko kwaye kunqanda unyawo oluhlala ixesha elide ngenxa yokusetyenziswa kwephepha kancinci. Kwakhona, ekubeni i-solder iphinda ifakwe kwindawo ye-vacuum, kuya kubakho i-oxidation encinci kwaye ngoko ke amalunga omelele kwaye ahlala ixesha elide.
Ukusukela oko yaqalayo, itekhnoloji ye-vacuum reflow iye yahamba indlela ende. Oomatshini bexesha langoku bahlala besebenzisa i-elektroniki ephucukileyo kunye nesoftware ukunika ulawulo lwexesha lokwenyani lobushushu, kwaye babeke iliso ngokuzenzekelayo wonke umsebenzi. Oku kuqinisekisa ukuba yonke i-soldered joint iya kufana kwaye ixhomekeke, ngokuthobela imigangatho engqongqo yokulawula umgangatho woshishino.
Ngaphaya koko, ukutyhutyha kwakhona kwevacuum kuyasebenza kwiintlobo ngeentlobo zemathiriyeli kubandakanya isinyithi esingaqhelekanga kunye neealloyi ezikhethekileyo. Yandise izakhono zabavelisi kunye neenjineli ukwenza izixhobo ze-elektroniki ezintsonkothileyo.
Ngokungafaniyo neendlela zemveli zokuthambisa ezisebenzisa nokuba ngamadangatye avulekileyo okanye iipleyiti ezishushu, itekhnoloji yokucoca ngokutsha inika abantu ukhetho olukhuselekileyo nolungcono. Ukunyibilikisa i-solder phantsi kwe-vacuum kuphelisa nayiphi na ingozi yokushisa okanye ukutshisa izinto ezinokutsha. Oku kunciphisa kakhulu amathuba eengozi kwaye eso sesinye isizathu esibambekayo sokuba kutheni amashishini amaninzi ekhetha ukuphinda kuqhutyelwe kwakhona.
Imeko ephambili yokusetyenziswa kwetekhnoloji ye-vacuum reflow ikwishishini le-elektroniki, njengoko umgangatho odibeneyo we-solder kunye nokuthembeka kubalulekile ekuqinisekiseni ukuba izixhobo zombane zisebenza ngokuchanekileyo. Ikwangqinwe kakuhle kwi-aerospace, amashishini ezonyango kunye nomkhosi. Ivacuum reflow ihlala iyinkqubo ebaluleke kakhulu endaweni yeeprojekthi ezifuna ukusetyenziswa kwezinto ezibuthathaka okanye izixhobo ezidinga isisombululo esisebenzayo nesichanekileyo.
I-vacuum reflow ekugqibeleni ifuna umnini womatshini wokuphinda ukhuphe ivacuum, onokuwufumana kubaboneleli abahlukeneyo. Umsebenzisi ukhetha ubushushu kunye ne-vacuum ngokwemathiriyeli yakhe yophando enikezwe kwiinkcukacha zenkqubo ye-CVD. Emva koko balayisha iitshiphusi kunye neesekethe ukuba zithengiswe kwibhodi ene-solder paste, ngaphambi kokuyibeka kumatshini.
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